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MaxOneSemi
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Company Profile

MaxOneSemi was established in 2015. It is a high-tech enterprise specializing in the research, development and production of semiconductor chip test probe cards. The company's headquarters is located in Suzhou Industrial Park, and it has subsidiaries in Shanghai, Nantong and Hefei. As a leading enterprise in the field of probe cards in China, Qiang Half Semiconductor has gathered top-notch technical talents in the industry. It always pays attention to customer needs and continuously innovates. It is one of the earliest enterprises in China to complete the research and development and mass production of high-end MEMS probe cards, and is a representative enterprise with strong independent innovation and import substitution capabilities in the field of high-end manufacturing. The company is committed to becoming a world-class supplier of integrated solution for integrated circuit testing interfaces.

  • MaxOneSemi
    vision
    The leader of human life
  • MaxOneSemi
    mission
    A member of an interstellar civilization
  • MaxOneSemi
    policy
    Quality is the lifeblood of an enterprise.

Honorary Qualifications

MaxOneSemi
gazelle company
MaxOneSemi
Leading technological talents
MaxOneSemi
new high-tech enterprise
MaxOneSemi
"little giant" firm
MaxOneSemi
Chinese IC unicorn
MaxOneSemi
2024 Jiangsu Province ranks among the top unicorn enterprises
MaxOneSemi
Potential unicorn enterprises in the Suzhou South National Independent Innovation Demonstration Zone

Development History

The company was established; the cantilever probe card: designed for low-end chip testing, featuring advantages in delivery time and cost.

2015

Vertical probe card is shipped; the vertical probe card based on mechanical processing of probes is mainly used for testing chips of FCBGA packaging type.

2016

The R&D department was established; the MEMS process R&D department was set up, and MEMS laboratory samples were successfully produced.

2017

2D MEMS probe card is delivered; vertical structure, MEMS process processed probes, for testing of high-end SOC chips such as mobile AP, CPU, GPU, AI computing power and other types of chips.

2019

MEMS thin-film probe cards have been delivered; MEMS process manufacturing, targeting high-frequency testing, such as radio frequency, filters, and millimeter waves.

2021

2.5D MEMS probe card is delivered; featuring a micro cantilever beam structure, the probe is processed using MEMS technology, and is designed for parallel and high-efficiency testing of storage-type chips (FLASHDRAM).

2023

Research Strength

The company has established a dedicated R&D team focusing on technological innovation in probes and probe cards. As of September 30, 2025, the company has mastered 24 core technologies and obtained 182 authorized patents, including 72 domestic invention patents and 6 overseas invention patents. The company is a leading market player with independent MEMS probe manufacturing technology and the ability to mass-produce and sell MEMS probe cards.