Feature

It has the characteristics of low cost, short production cycle and long test lifespan. It is mainly applied to storage chips such as NOR Flash and EEPROM, as well as components like CIS and MCU.

Feature

It has the characteristics of long test life and stable test performance, and is mainly applied to mobile phone AP, power management chips, radio frequency transceiver chips, and other SoCs.

Feature

It features a high number of parallel measurements, a large number of pins, and a large planting area. It is mainly applied in storage chips such as HBM, NAND Flash, and DRAM, as well as CIS chips.

Feature

Vertical type, MEMS process fabricated probes, for high-end SOC testing, such as mobile AP, CPU, GPU, AI computing power and other series of chips.

Feature

MEMS technology fabrication, suitable for high-frequency testing, such as RF and optoelectronic chips, etc.